Architecture Analyst

Position: Package Architecture Analyst Translate product requirements into detailed package architecture specificationsLead technology trade-off decisions across electrical, mechanical, thermal, and reliability requirementsCollaborate with silicon, hardware, and package leads to deliver package outputs and address roadblocksOversee packaging development, including designs, processes, and proceduresDrive continuous improvement in packaging quality standardsTroubleshoot package designs and resolve technical issuesDeliver innovative, cost-effective packaging solutionsPartner with manufacturing teams on design-to-production transitions and tape-out readinessApply Design for Manufacturing principles to optimize manufacturability and production efficiencyMaintain and refine technical documentation for package development processesRequirementsBachelor's degree in Mechanical Engineering, Electrical Engineering, Materials Science, or related field with 9+ years of hands-on experience, OR a Master's degree in a relevant field with 6+ years of hands-on experience, OR a PhD in a relevant field with 4+ years of hands-on experience4+ years of experience defining semiconductor/electronic package architectures and developing technical documentationExperience applying Design for Manufacturing (DFM) principlesExperience utilizing Design of Experiments (DOE) methodologiesExperience troubleshooting package design and manufacturing issuesAdvanced understanding of semiconductor packaging technologies and industry trendsExperience leading cross-disciplinary teams in a technical environmentExcellent analytical, communication, and problem-solving skillsAbility to collaborate cross-functionally with silicon, hardware, and manufacturing teamsCore CompetenciesDemonstrates expertise in semiconductor packaging technologies and Design for Manufacturing principles, with a strong focus on delivering innovative packaging solutions and optimizing production efficiency. Proven ability to lead cross-disciplinary teams and troubleshoot complex design and manufacturing issues.Highest-signal resume keywordsSemiconductor Packaging ArchitectureDesign for Manufacturing (DFM)Design of Experiments (DOE)Technical Documentation DevelopmentCross-Disciplinary Team LeadershipHard SkillsMechanical EngineeringElectrical EngineeringMaterials SciencePackaging DevelopmentTroubleshooting Package DesignContinuous ImprovementCost-Effective Packaging SolutionsManufacturing TransitionTechnical DocumentationAnalytical Problem-SolvingSoft SkillsExcellent CommunicationCollaborationAnalytical SkillsIndustry KeywordsSemiconductor Packaging TechnologiesManufacturing EfficiencyTechnical EnvironmentIndustry TrendsCross-Functional Collaboration