Integrated Circuit Packaging Architect

Join us as we shape the future of AI and beyond. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management Work with product architects in early definition stage to understand and define package architectures, roadmapLead new package technology development initiatives from concept to full technology qualificationDrive Test vehicle design and manufacturing to establish design rules, DFM/DFY guidelinesEstablish Yield roadmap and lead implementation of yield, data analytic tools as needPreferred Experience: Experience in semiconductor technology development roleExperience working with manufacturing partners such as suppliers, OSATs and foundry partners.In-depth knowledge in material science, thin film process development, and/or packagingExperience in a leadership role driving cross-functional teamsProven track record of driving yield improvement, defect reduction in semiconductor fab or packaging environment Education:

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