Aug. 24, 2026

Senior Co-Design Architect: Power, Thermal & Packaging (Equity)

NVIDIA AI Eugene, Oregon

NVIDIA AI in Eugene, Oregon, seeks a senior Co-Design Architect to push the physical boundaries of chip performance. You will lead analysis of power delivery, thermal limits, and packaging, predicting constraints and crafting cross-domain solutions spanning silicon, firmware, and manufacturing. You will evaluate emerging packaging tech and drive system-manufacturing co-design for higher performance and reliability.

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